M08D

Core Module

M08D

AIoT Stamp-hole Core Module — Voice & Audio

Rockchip RK2108D + RK962

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Key Features

Why M08D?

AI Voice on-device: HiFi3 DSP + VAD + Codec ADC, local wake/recognition, AEC, noise reduction
BLE Broadcast / Auracast: single source to unlimited receivers with ≤10 ms latency
Ultra-Low Power: static current down to 0.28 mA (DTIM=10), battery-friendly
Compact & Integrated: 16×16 mm, dual crystal + Flash + ESD + RF match, SMT-friendly
Display: up to 720P (1280×720), MIPI DSI / RGB
Mic Array: dual-mic / 4-mic with full voice algorithm suite

Specifications

Detailed Specifications

CPU	ARM Cortex-M4F @ up to 396 MHz, FPU
DSP	HiFi3 @ up to 594 MHz, 64/512 KB TCM
Wireless	Wi-Fi 4 2.4 GHz + BT 5.3 dual mode (RK962)
Memory	1 MB Share Memory + 64 Mbit NOR Flash (optional 512 Mbit)
Display	MIPI DSI 2-lane / RGB 8-bit, max 720P @60fps
Audio	I2S×2 / PDM 6ch / Codec ADC 2ch, 192 kHz, 16-32 bit
USB	1 × USB 2.0 Device, 480 Mbps
Power	VCC_3V3 + LDO 0.9/0.9/1.6 V
Package	16.0 × 16.0 mm stamp-hole LGA, 60 edge pads
Cert.	WFA Wi-Fi (2023.05) + BQB BT (2023.04)
Operating	−30 ~ +85 °C

Applications

Scenarios

AI voice toysSmart home control panelsSoundbarLive-streaming micBLE Auracast receiversSmall appliance displays

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